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  1. Back-drilling and Via-in-Pad: Advanced Capabilities for High-Speed Designs
    Back-drilling and Via-in-Pad: Advanced Capabilities for High-Speed Designs

    High-speed digital designs operating at multi-gigabit data rates demand signal integrity performance that conventional PCB via structures simply cannot deliver. Signal frequencies in modern interfaces such as PCIe 5.0/6.0, 400G Ethernet, DDR5, and ...

    https://www.pcb-fabrication-china.com/pcb-fabrication-capabilities/back-drilling-and-via-in-pad-advanced-capabilities-for-high-speed-designs/
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