The

PCB Fabrication Process

is a highly precise and multi-stage engineering journey that transforms digital design files into tangible, functional circuit boards. It begins with rigorous pre-production checks (DFM) and material preparation, followed by the intricate transfer of circuit patterns onto copper-clad laminates using photolithography or Laser Direct Imaging (LDI). Through controlled chemical etching, unwanted copper is removed to form accurate conductive traces. For multilayer boards, the process involves stacking, lamination under heat and pressure, precision drilling, and electroplating to establish reliable interlayer connections.